Masaki Kitabata

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This paper describes a copper interconnection failure in a damascene process of a system on chip (SoC) caused by the plating bath degradation in copper electroplating equipment. By “semimetrics” using EES (Equipment Engineering System) data for many variables in the equipment and some statistical methods, it is clarified that the root cause of(More)
This paper describes the yield degradation caused by nickel silicide (NiSi) disconnection in a salicide formation process used in system on chip (SoC) manufacturing. Physical analysis revealed that the failure was caused by a NiSi disconnection on a gate electrode. To identify the root cause in such a complicated issue, “Semimetrics,” which(More)
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