Martin Trentzsch

  • Citations Per Year
Learn More
In the presented work we demonstrate an efficient way to improve the balance between performance and reliability in the case that microprocessor speed is limited by a pMOS dominated speed path. It is shown that with differential targeted, thicker pMOS gate oxide thickness (TOX), realized by the selective control of nMOS and pMOS GOX, pMOS degradation in(More)
This work shows how fast wafer-level reliability (fWLR) inline tests allow to quickly screen the intrinsic reliability of High-k / Metal Gate (HK/MG) process splits in an effective manner. Various Hf based gate stack compositions such as pure HfO<inf>2</inf>, Hf<inf>x</inf>Zr<inf>1-x</inf>O<inf>2</inf> and Hf<inf>x</inf>Si<inf>1-x</inf>O<inf>2</inf> are(More)
The physical properties of metal-organic chemical vapor deposition (MOCVD) and atomic layer deposition (ALD) deposited HfZrO4 films have been analyzed in detail by atom probe tomography, X-ray photoelectron spectroscopy, Rutherford backscattering spectrometry, transmission electron microscopy, atomic force microscopy, variable angle spectroscopic(More)
The interaction between oxygen vacancies and La atoms in the La doped HfO(2) dielectric were studied using first principles total energy calculations. La dopants in the vicinity of a neutral oxygen vacancy (V(O)) show lower formation energy compared to the La defects far from V(O) centres. La doping in HfO(2) leads to the shift of the defect states of(More)
  • 1