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— With the progress of deep submicron technology power consumption and temperature related issues have become dominant factors for chip design. Therefore, very large-scale integrated systems like Systems-on-Chip (SoCs) are exposed to an increasing thermal stress. On the one hand, this necessitates effective mechanisms for thermal management. On the other(More)
With a fast rising productivity and even faster rising integration densities, i.e., design-productivity-gap, energy and power dissipation are critical topics in high level system design more than ever. Thermal aware system design, reliable power delivery, and the overall energy dissipation are only few crucial design properties. In this work we present a(More)
As technology reaches nanoscale order, interconnection systems account for the largest part of power consumption in Systems-on-Chip. Hence, an early and sufficiently accurate power estimation technique is needed for making the right design decisions. In this paper we present a method for system-level power estimation of interconnection fabrics in(More)
—Temperature management and signal integrity are two highly relevant challenges for nano scale CMOS devices. As temperature of integrated circuits affects the frequency of defect mechanisms' occurrence and consequently influences reliability, temperature monitoring is inevitable. To provide the necessary thermal sensors, different techniques are available.(More)
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