Learn More
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level packaging (WLP) demonstrates a huge potential to reduce these costs due to a smaller size of the total package, improved performance and shorter time to market. A special group of(More)
The purpose of this extended abstract is to present a new application of spray coating process which greatly improves the process of performing underfill of suspended structures (air bridges) with low-k polymer. By using spray coating, it is possible to realize as much as a nine-fold materials savings, plus a three fold time savings. This article describes(More)
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level packaging (WLP) demonstrates a huge potential to reduce these costs due to a smaller size of the total package, improved performance and shorter time to market. A special group of(More)
  • 1