Mark R. Sweet

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Power microelectronics plays an important role in many of the consumer and industrial applications today. With increase in demand for energy savings and efficient systems, the requirements for rapid advancement in MOS controlled power semiconductor device concepts and technologies are becoming more crucial than ever before. This puts a considerable pressure(More)
In this paper, thermal cycling of silicon power semiconductor dies mounted on polycrystalline diamond and aluminum nitride insulated substrates is presented. Thermal strain, stress and safety factor was analysed using ANSYS<sup>&#x00AE;</sup> static structural analyses tool to understand the dependence of thermal strain and stress. Polycrystalline diamond(More)
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