Marc Zemel

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The first experiences from Large Area Panel processing (LAP) and Sequential Build Up (SBU) technologies using ANVIK HEXSCAN 2050 SME UV-excimer lithography equipment and photopatternable ORMOCER** dielectrica is presented. The novel equipment enables 5 μm resolution patterning of surfaces up to a size of 610 mm x 610 mm (24 inches x 24 inches). The maximal(More)
In order to limit new product development time and ensure quality, the engineer needs to understand the capability of the manufacturing process that will be used. Specifically, the engineer must be able to assess the feasibility of producing the parameters (i.e. dimensions and physical properties) of a design within their specified tolerances and understand(More)
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