Marc G. D. Geers

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In the past decades, considerable progress had been made in bridging the mechanics of materials to other disciplines, e.g. downscaling to the field ofmaterials science or upscaling to the field of structural engineering.Within thiswide context, this paper reviews the stateof-the-art of a particular, yet powerful, method, i.e. computational homogenization.(More)
Multiple length scales are involved in the development of traumatic brain injury, where the global mechanics of the head level are responsible for local physiological impairment of brain cells. In this study, a relation between the mechanical state at the tissue level and the cellular level is established. A model has been developed that is based on(More)
The human brain is the continuous subject of extensive investigation aimed at understanding its behavior and function. Despite a clear evidence that mechanical factors play an important role in regulating brain activity, current research efforts focus mainly on the biochemical or electrophysiological activity of the brain. Here, we show that classical(More)
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion. Especially the introduction of copper and low-k dielectric materials cause some reliability problems. Numerical simulation tools can assist developers to meet this challenge. This paper considers the first bond integrity(More)
The length scales involved in the development of diffuse axonal injury typically range from the head level (i.e., mechanical loading) to the cellular level. The parts of the brain that are vulnerable to this type of injury are mainly the brainstem and the corpus callosum, which are regions with highly anisotropically oriented axons. Within these parts,(More)
Different length scales from micrometers to several decimeters play an important role in diffuse axonal injury. The kinematics at the head level result in local impairments at the cellular level. Finite element methods can be used for predicting brain injury caused by a mechanical loading of the head. Because of its oriented microstructure, the sensitivity(More)
A digital image correlation (DIC) algorithm was employed to measure microscopic strain-field evolution in shear-loaded model solder interconnections made out of a number of Sn-based alloys. Four different solder alloys studied were Sn–36Pb–2Ag, Sn–3.8Ag–0.7Cu (SAC), Sn–3.3Ag–3.82Bi, and Sn–8Zn–3Bi. The measured strain fields were correlated with damage(More)