Mahmudur R. Chowdhury

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Lead free solder materials are susceptible to significant creep deformations in harsh high temperature environments including automotive, avionics, military, and oil exploration applications. In addition, dramatic degradations will occur in the creep responses of lead free solder alloys when they are exposed to long term isothermal aging during product(More)
Reliable lead free solders are needed for products exposed to extreme environments such as those used in the automotive, avionics, and oil-exploration industries, as well as in military applications. In this study, stress-strain curves have been measured for several doped Sn-Ag-Cu (SAC) solder materials at high temperatures up to 200°C, and their(More)
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