Maher Bakri-Kassem

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Two microelectromechanical systems (MEMS) curled-plate variable capacitors, built in 0.35-mum CMOS technology, are presented. The plates of the presented capacitors are intentionally curled upward to control the tuning performance. A newly developed maskless post-processing technique that is appropriate for MEMS/CMOS circuits is also presented. This(More)
A microelectromechanical systems (MEMS) variable capacitor having two movable plates loaded with a nitride layer is proposed. A trench in the silicon substrate underneath the capacitor is used to decrease the parasitic capacitance. The use of an insulation dielectric layer on the bottom plate of the MEMS capacitor increases the capacitor's tuning range and(More)
A microelectromechanical systems (MEMS) variable capacitor having additional carrier beams is proposed. The use of carrier beams makes it possible to obtain an equivalent nonlinear spring constant, which increases the capacitor’s tuning range and prevents the top plate from collapsing at a tuning range of 50%. A lumped element model and a continuous model(More)
Latching RF MEMS Switches of Single-Pole-Single-Throw (SPST), Single-Pole-Double-Throw (SPDT) and Single-Pole-Triple-Throw (SP3T) types are proposed. The switches are built of a 20 μm thick nickel layer covered with a plated 2 μm gold on the top and side walls of nickel layer eliminating any potential warping due to thermal mismatch. The(More)
A novel parallel-plate MEMS variable capacitor with a thin-film vertical comb actuator is proposed. The actuator can vertically displace both plates of the capacitor. Making use of the fringing held, this actuator exhibits linear displacement behavior, caused by the induced electrostatic force between the actuator's electrodes. The proposed capacitor has a(More)
Surface micromachining technology implemented by the PolyMUMPs process is used to fabricate on-chip RF microelectromechanical systems (MEMS) components. Parasitic effects due to coupling to the low-resistivity silicon substrate are eliminated by the introduction of a customized wet etching post-processing technique. The maskless post-processing technique(More)
This paper presents a high-efficiency wideband planar dielectric tapered antenna designed for 60 GHz integrated applications fabricated through a novel process compatible with silicon technology. The antenna is composed of five parts: a CPW line, a balun, a tapered slot line, a dielectric tapered antenna and parasitic elements. Single antenna has a(More)
An efficient method for energy harvesting through MEMS based devices, driven by ambient vibrations is presented. This particular method relies on the utilization of time varying magnetic fields to induce electromotive forces which in turn drive current through coils fabricated on a substrate. This allows for the conversion of energy contained within(More)
A novel reconfigurable CMOS class-F power amplifier is proposed in this paper which can adapt to load variations resulted from the hand effect on a mobile phone. Reconfigurability is achieved by using MEMS switches that are integrated monolithically in the CMOS technology along the rest of the circuit, reducing the cost and size. This structure integrates(More)
In this paper, a new electro-thermal dynamic model for V-shaped thermal micro-electromechanical actuators is proposed. The experimental observation of the dynamic voltage-displacement relationship for a thermal micro-actuator shows a complex characteristic indicating the simultaneous presence of electrical/thermal energy storage and mechanical energy(More)