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This paper presents a simple and accurate model for the multilayer microstrip, which can be easily implemented using closed-form microstrip design formulas. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The shunt impedance parameters per unit length are derived from the complex(More)
Keywords: Ultra-thin chips Flexible electronics Bending strength Minimum bending radius a b s t r a c t Ultra-thin chips of less than 20 lm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in(More)
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