Maarten Cauwe

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Measuring the quality of human health and wellbeing is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even(More)
Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology, which has a broad range of industrial and medical electronic applications. This goal is achieved in a two-step approach: at first thinned dies are embedded in a polyimide interposer with a fine-pitch metal(More)
Ultra-thin chips of less than 20 lm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these products will be bent to a very high curvature, which puts a(More)
This paper presents a simple and accurate model for the multilayer microstrip, which can be easily implemented using closed-form microstrip design formulas. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The shunt impedance parameters per unit length are derived from the complex(More)
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