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Product-Oriented System-in-Package (SiP) Technology for Next Generation Wireless/Portable Electronics
Demands for the advancement of electronic packaging technology are relentless, from pursuing smaller package size with greater functionality to lowering the package cost. Notwithstanding, comparedExpand
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System-in-Package (SiP) Design: Issues, Approaches and Solutions
With an increasing demand of low-cost, small-size, high- performance and multi-function portable and wireless applications, System-in-Package (SiP), which provides various advantages includingExpand
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