• Publications
  • Influence
Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling.
Aligned carbon nanotube (CNT) arrays were fabricated from a multilayer catalyst configuration by microwave plasma-enhanced chemical vapor deposition (PECVD). The effects of the thickness andExpand
  • 129
  • 3
Water‐Based Isotropically Conductive Adhesives: Towards Green and Low‐Cost Flexible Electronics
This paper reports the fi rst high-performance water-based isotropically conductive adhesives (WBICAs) – a promising material for both electrical interconnects and printed circuits for ultralow-costExpand
  • 75
  • 2
  • PDF
Passive UHF RFID Packaging With Electromagnetic Band Gap (EBG) Material for Metallic Objects Tracking
  • B. Gao, M. Yuen
  • Engineering
  • IEEE Transactions on Components, Packaging and…
  • 14 July 2011
Passive ultrahigh frequency (UHF) radio frequency identification (RFID) is a promising technology for products tracking in logistics or routing packages in supply chain. However, passive UHF RFIDExpand
  • 41
  • 1
Electro-deposition of CoNi2S4 flower-like nanosheets on 3D hierarchically porous nickel skeletons with high electrochemical capacitive performance
Ternary cobalt nickel sulfide (CoNi2S4) flower-like nanosheets are directly grown on three dimensional (3D) hierarchically porous nickel skeletons by one-step electro-deposition. The resultant 3DExpand
  • 55
  • 1
Thermal performance of LED packages for solid state lighting with novel cooling solutions
With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junctionExpand
  • 10
  • 1
A multiscale method to predict delamination in Cu-epoxy systems in electronic packages
The interface of epoxy molding compound (EMC) and Cu is known to be one of the weakest points in the electronic package design. Self-assembly monolayer (SAM) has been suggested as adhesion promoterExpand
  • 6
  • 1
Thermal improvement of die attach with iodine treatment and its application in solid state lighting
The mechanism of thermal conductivity enhancement of silver epoxy based die attach materials (DA) by iodine treatment is studied. Iodine treatment is found to be able to uniform the polymer networkExpand
  • 2
  • 1
Multi-scale modeling of moisture transfer in electronic packaging
  • H. Fan, M. Yuen
  • Materials Science
  • 11th International Conference on Electronic…
  • 23 September 2010
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning in plastic-encapsulated IC packages is a defect frequently occurring during the solder reflow due toExpand
  • 2
  • 1
Luminogenic materials constructed from tetraphenylethene building blocks: Synthesis, aggregation-induced emission, two-photon absorption, light refraction, and explosive detection
Luminogenic molecules [(TPE)3 (1), TPE-C = C-TPE-C = C-TPE (2), and TPE-C≡C-TPE-C≡C-TPE (3)] and their polymers P1–P3 are constructed from tetraphenylethene (TPE) building blocks in high yields byExpand
  • 177
  • PDF
Printed electrically conductive composites: conductive filler designs and surface engineering
Enormous efforts have been made towards the next generation of flexible, low-cost, environmentally benign printed electronics. In this regard, advanced materials for the printed conductive lines andExpand
  • 108