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Topological nodal semimetals
We present a study of “nodal-semimetal” phases in which nondegenerate conduction and valence bands touch at points (the “Weyl semimetal”) or lines (the “line-node semimetal”) in three-dimensional
Parallel magnetic field driven quantum phase transition in a thin topological insulator film
It is well-known that helical surface states of a three-dimensional topological insulator (TI) do not respond to a static in-plane magnetic field. Formally this occurs because the in-plane magnetic
Highly-stable silver nanobelts joined via diffusion-free attachment.
TLDR
The oriented attachment displayed by nanobelts represents a new approach to achieving valuable reductions in network resistance, disentangled from the instability and diffusion-driven failure by nanoparticle degradation displayed by competing silver nanoparticles.
Factors affecting activation energy for pd-coated cu ball bond resistance degradation on Al bond pads in high temperature storage
Copper wire bonds have become a mainstay in many electronics areas, including automotive, where more data is needed regarding the reliability of Cu wire bonds on Al pads in high temperature
High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds
Abstract Reliability of wire bonds made with palladium-coated copper (PCC) wire of 25 μm diameter is studied by measuring the wire bond resistance increase over time in high temperature storage at ...
Effects of Epoxy Molding Compound on Electrical Resistance Degradation of Pd-Coated Cu Wire Bonds in the 175 °C to 225 °C Range
We present electrical resistance measurements of PCC wires bonded to Al pads and aged at temperatures of 175 °C, 200 °C, and 225 °C. Wires were arranged to enable four-wire measurements of pairs of
Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation
  • M. Hook
  • Engineering
  • 19 September 2018
Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications
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