M. N. Tirolli

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A fabrication process of silicon field-emission arrays is reported, in which thin films of amorphous hydrogenated carbon (a-C:H) are employed as masks in a two-step plasma-etching process, using pure SF6 and a mixture of SF6 and O2. In comparison with processes that involve SiO2 masks, the use of a-C:H improved the selectivity of the plasma etching,(More)
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