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Liquid crystal polymer (LCP) is a material that has gained attention as a potential high-performance microwave substrate and packaging material. This investigation uses several methods to determine the electrical properties of LCP for millimeter-wave frequencies. Microstrip ring resonators and cavity resonators are measured in order to characterize the(More)
In this paper, inkjet-printed UHF and microwave circuits fabricated on paper substrates are investigated for the first time as an approach that aims for a system-level solution for fast and ultra-low-cost mass production. First, the RF characteristics of the paper substrate are studied by using the microstrip ring resonator in order to characterize the(More)
In this paper, microstrip coupled-line bandpass filters using a Koch fractal shape are proposed for the first time. These filters are fabricated on a liquid crystal polymer (LCP) substrate for Ku-band. Conventional microstrip coupled-line filters are very popular for RF front ends because they can be fabricated easily. However, their large second harmonic(More)
This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard(More)
A vertically-integrated, fully inkjet-printed mi­ crowave structure is demonstrated for the first time, where both the metallic elements and the platform substrate are completely fabricated with the additive inkjet printing process. The surface uniformity of SU-S polymer ink is outlined as a function of layer deposition to provide a desirable profile for a(More)
In this paper, the feasibility of inkjet printing of circuit and microwave structures on paper-based substrates is investigated for the first time in the implementation of a complete low-cost wireless platform for sensors. First, the system-level design of the module including the amplifier characterization were carried out to ensure optimum performance of(More)
This work deals with the design and fabrication of antennas for radio frequency identification (RFID) tag devices operating in the low microwave frequency range. Paper substrate material and inkjet printing process have been used to guarantee mechanical flexibility and ultra-low production costs of the antenna. A new antenna design methodology has been(More)
In this paper, three-dimensional (3-D) integrated cavity resonators and filters consisting of via walls are demonstrated as a system-on-package compact solution for RF front-end modules at 60 GHz using low-temperature cofired ceramic (LTCC) technology. Slot excitation with a /spl lambda/g/4 open stub has been applied and evaluated in terms of experimental(More)
In this paper, we proposed the development and implementation of novel paper-based UHF RFID designs for anti-counterfeiting and security. Miniaturization and global-band antenna configurations and utilization of inkjet printing techniques in/on organic substrates, such as paper, that will enable the low cost and large-scale implementation of RFID-enabled(More)
Finite-ground coplanar (FGC) waveguide lines on top of polyimide layers are frequently used to construct three-dimensional Si-SiGe monolithic microwave/millimeter-wave integrated circuits on silicon substrates. Requirements for high-density, low-cost, and compact RF front ends on silicon can lead, however, to high crosstalk between FGC lines and overall(More)