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S-parameter measurements were performed on special test lines embedded in an 8 copper metal layer test chip in order to determine the propagation constant y(f) and the complex characteristic impedance Z/sub 0/(f). Measurement results are presented for signal lines in the 7/sup th/ metal layer showing very good agreement with FEM-simulations in the frequency(More)
The influence of the ground line position on the signal shape in the time domain is investigated in the presence of grounded substrates by M. F. Ktata et al. (2003) with different conductivities of 10 S/m (low) and 100 S/m (medium). It is shown that the impact of substrate effects on time domain signals depends on the substrate conductivity, on the relative(More)
The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results(More)
We investigate the impact of ground line position as well as the effects of conductive substrates with different conductivities of 10 S/m (low), 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnects. Characteristic line parameters obtained from field calculations are validated with two-port network analyzer measurements of specially designed test(More)
The impact of the ground line position on the line parameters of signal interconnects built in a 110-nm CMOS technology is investigated in the presence of a conductive substrate. Characteristic line parameters obtained from simulations are validated with two-port network analyzer measurements of specially designed test structures in a frequency range up to(More)
In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from 1 Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly(More)
In this paper, we investigate the interaction between redistribution traces and on-chip interconnects in memory chip packages. The electromagnetic interaction is shown both in the frequency and in the time domain. In addition the impact of this interaction on the performance of memory component(s) is explored.
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