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In this paper, we present the design and development of thin-film liquid-crystal-polymer (LCP) surface-mount packages for Ka-band applications. The packages are constructed using multilayer LCP films and are surface mounted on a printed circuit board (PCB). Our experimental results demonstrate that the package feed-through transition including a PCB launch(More)
We present the development of an ultrahigh moisture-resistant enclosure for RF microelectromechanical system (MEMS) switches using liquid-crystal polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a silicon MEMS switch to create a package. The LCP-cap package has an insertion loss of less than 0.2 dB at X-band. E595 outgas(More)
We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package,(More)
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