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+ Dept. of Electrical & Electronic Eng., Tottori University, Koyama-minami, Tottori, 680-8522 Japan § Central Research Laboratory, Hitachi Ltd., Kokubunji, Tokyo, 185-8601 Japan ¶ LSI Product Development Headquarters, Rohm Co.Ltd., Kouhoku-ku, Yokohama, 222-8575 Japan Semiconductor Company, SANYO Electric Co.,Ltd., Oizumi-machi, Oura-gun, Gunma, 370-0596(More)
This paper presents a wireless system to reach a 300-Mbps transmit rate in OFDM wireless communication and a hardware architecture for the OFDM baseband transceiver. We study optimum parameters about OFDM frame, DFT size, and allocation of subcarriers that are required for the wireless system with a 80-MHz bandwidth, extending the IEEE802.11a standard. The(More)
This paper describes a VLSI design of highthroughput OFDM transceivers targeted to future wireless LAN systems. The optimum parameters composing a new packet OFDM frame are discussed by expanding the IEEE802.11a standard. The proposed system provides a maximum transfer rate of 600 Mbps by use of an 80-MHz occupied bandwidth and a MIMO technique. The(More)
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