We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Synchrotron white beam X-ray topography (SXRT) and photoelastic stress measurements were used to characterize resulting strain fields after mechanical dicing and laser grooving of bare silicon wafers. The distribution and propagation of the strain fields can be characterized by both methods. In contrast to mechanical dicing, the laser grooving process(More)
  • 1