M.F. Bailon

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AFM tool has become a very important analytical tool in the semiconductor industry specifically in the field of failure analysis. However due to the increasing complexity of the structure and architecture of ICs today, continuous improvement and development on this technique to expand its capabilities is an essential aspect to FA. In this paper, we(More)
We have developed a defect localization technique at room temperature for devices with nano-leakage and fails only at either cold (0/spl deg/C) or hot (110/spl deg/C) temperature testing using conducting atomic force microscopy (C-AFM) and tunneling atomic force microscope (TUNA). With this technique, we isolated the failure to a single transistor leg (i.e.(More)
In this investigation, a combination of old and new FA techniques has been utilized in the analysis of EOS failure in 90nm devices. We illustrate how information from conventional techniques and new innovative techniques can lead to successful root cause analysis of the failure mechanism. One of the innovative techniques used in the study is spectral(More)
We present the 2D emission spectral imaging capability developed for the infrared emission microscope (IREM) tool. This innovative technique can provide fundamental physical information on the nature of emissions in device structures and can therefore be use for quick and accurate detection and identification of discrete elements in ICs. The emission(More)
Localization, identification and characterization of EOS-induced defects found in submicron devices were demonstrated using a new FA procedure. IR photon emission and circuit analysis were used for defect localization while spectral profile of photon emission was utilized for defect finger-printing analysis. Finally, frontside and backside FA methods were(More)
In the event of leakage failures in plastic ball grid array packages (PBGA), standard failure analysis procedure includes acid etching (called decapsulation) of the mold compound to expose the die. Those that are recovering after decapsulation were just closed as a random event caused by a foreign material (FM) in the mold compound. The need to determine(More)
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