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Life time predictions of microelectronics products are based on accelerated tests (ALT) [1]. The statistical distribution of failures, as typically shown in a Weibull plot, arise from the random variables such as material properties and geometric tolerances in manufacturing. These variations give rise to uncertainty in product life [2]. During the project,(More)
Residual stresses that develop in a nano-Ag ICA interconnect during the assembly of a flip-chip pin grid array are investigated. A multiscale modeling framework is adopted to link the nano-sized particles to the interconnect level. This is achieved by the numerical analysis of the mechanical response during the curing process through the computational(More)
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