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High-performance passive components are keys to reach system-on-a-chip (SOC) solution of mixed-signal and radio frequency (RF) circuit design. This paper presents the fabrication and integration of high performance mixed-signal and RF passive components using industrial standard 0.13/spl mu/m Cu BEOL technologies. On-chip inductor with 6/spl mu/m(More)
The capacitance density of industrial low-cost metal-insulator-metal (MIM) capacitor in Cu back-end-of-line (BEOL) technologies has been improved to 1.5 fF//spl mu/m/sup 2/ which is 50% higher than the current foundry standard of 1.5 fF//spl mu/m/sup 2/ based in J. C. Guo et al. (2003), P. Zurcher et al. (2002) and C. H. Ng et al. (2002). In this paper, we(More)
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