M. Boscardinc

Learn More
  • S. Grinsteina, M. Baselgab, +19 authors S. Tsiskaridzea
  • 2013
Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the(More)
Imaging capabilities, spatial resolution and spectroscopic analysis have been performed to compare the characteristics of imaging systems based on pixel detectors of different thickness. Each system consists of a single photon counting chip (PCC), developed in the framework of the Medipix Collaboration, bump bonded to a silicon detector. The detector is a(More)
  • 1