Learn More
Besides foundry facilities, Computer-Aided Design (CAD)tools are also required to move microsystems from researchprototypes to an industrial market. Currently available CADtools need extensions before they can be used for theautomated design of micromachined devices.This paper presents a low cost access to microsystemtechnology (MST), applied by the CMP(More)
<i>This paper illustrates an approach to design and validation of heterogeneous systems. The emphasis is placed on devices which incorporate MEMS parts in either a single mixed-technology (CMOS</i> + <i>micromachining) SOC device, or alternatively as a hybrid system with the MEMS part in a separate chip. The design flow is general, and it is illustrated for(More)
In this paper a methodology developed for the generation of transient compact models of packages and heat sinks from measured thermal transient results is described. The main advantage of generating dynamic compact models solely from measured results is the time-gain: the lengthy transient simulations, suggested by the DELPHI methodology can he omitted.(More)
A new algorithm has been developed for the layout based direct electro-thermal simulation of integrated circuits. The advantage of the direct electro-thermal simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the thermal nodes are added to the number of nodes of the network to be simulated. The(More)