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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
The recrystallization of β-Sn profoundly affects deformation and failure of Sn-Ag-Cu solder joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of recrystallized β-SnExpand
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Nanocopper Based Solder-Free Electronic Assembly
CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo.Expand
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Dependence of SnAgCu solder joint properties on solder microstructure
It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn andExpand
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A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
The present work offers both a complete, quantitative model and a conservative acceleration factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range of thermalExpand
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Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure
Effects of solder alloy, volume and pad finishes on various aspects of microstructure and the corresponding thermomechanical properties of SnAgCu solder joints were investigated. Particular attentionExpand
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Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions
Common damage accumulation rules fail to predict the fatigue life of solder joints under realistic service conditions where cycling amplitudes vary over time. A modification of Miner's rule of linearExpand
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Interpreting accelerated test results for lead free solder joints
Accelerated testing of microelectronics products and/or specially designed test vehicles may be useless or worse unless the results can be counted on to somehow reflect performance in service. ThisExpand
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Challenges for the prediction of solder joint life in long term vibration
In the absence of manufacturing defects the ultimate life of a microelectronics assembly in long-term vibration is likely to be limited by solder joint fatigue. So far relatively limited efforts haveExpand
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Recrystallization behavior of lead free and lead containing solder in cycling
The present work addresses the effects of thermomechanical history on the recrystallization behavior of lead free and backward compatible solder joints. 30 mil SAC305 balls were reflowed onto BGAExpand
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Effects of solder joint dimensions and assembly process on acceleration factors and life in thermal cycling of SnAgCu solder joints
Although far from always obvious to the practitioner the interpretation of accelerated thermal cycling results is often confounded by complex effects of the evolving solder microstructure. OneExpand
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