Luke J. Garner

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The microelectronic industry has continuously driven for greater integration of functionality and capability. This has led to some significant challenges for the industry. For example, to improve electrical performance, materials with low dielectric constants are being added to the silicon structures. These fragile materials in silicon interconnect layers(More)
Rising power dissipation requirements in modern semiconductor devices have created a need for high performance thermal solutions. These thermal solutions require increasing amounts of compression loading to ensure good conductance of thermal interface materials and retention of massive heat sinks in shock conditions. The impact of these loads on the(More)
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