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This paper presents the modeling of lossy substrate integrated waveguide interconnects and components by using the boundary integral-resonant mode expansion method. The extension of the numerical technique to account for conductor, dielectric and radiation losses is discussed. Moreover, a systematic investigation of the different contributions of loss and(More)
This paper presents an algorithm for the wide-band optimization of H- and E-plane waveguide components with irregular shapes. The algorithm is based on the boundary-integral-resonant-mode expansion method, used in conjunction with a variational technique, which permits the determination of the objective function and of its gradient by solving a single(More)
Substrate Integrated Waveguide (SIW) technology is the most promising candidate for the implementation of millimeter-wave (mm-wave) integrated circuits and systems for the next decade. Based on planar dielectric substrates with top and bottom metal layers perforated with metalized holes, SIW structures offer a compact, low loss, flexible, and cost-effective(More)
This paper presents the recent advances in the implementation of substrate integrated waveguide (SIW) components and circuits by additive manufacturing (AM) techniques. The use of AM allows introducing novel features in the design of SIW structures, ranging from fully three-dimensional geometries (impossibly to obtain with standard planar circuits(More)
— The additive manufacturing technique of 3D printing has become increasingly popular for designs that have been previously unachievable due to cost and design complexity. Due to the special mechanical properties of NinjaFlex [1], there is great potential for its use in the 3D printed fabrications of numerous RF applications, such as strain sensors and(More)
Substrate integrated waveguide, an emerging technology for microwave and millimeter-wave circuits, is affected by three loss mechanisms: ohmic and dielectric losses, standard waveguides, and radiation leakage. While ohmic and dielectric losses can be accurately determined by the analytical formulas of the equivalent rectangular waveguide, no equations are(More)
This paper presents an overview of the recent achievements in the development of novel components and manufacturing technologies for the next generation of wireless components and systems, suitable for the Internet of Things (IoT). The technological requirements of the IoT are discussed in this paper: they include, among others, the need for compact and(More)
A novel ridge substrate integrated waveguide (RSIW) with extended single-mode bandwidth is presented in this paper. The proposed structure is based on a substrate integrated waveguide including two dielectric layers with different permittivity. The ridge is implemented by a row of partial height metal vias, connected at the bottom by a metal strip. An RSIW(More)
This paper presents recent advances in the electromagnetic modeling of substrate integrated waveguide (SIW) components. In particular, the modeling of different aspects is discussed, namely the dispersion characteristics, the losses, and the overall device simulation. The different modeling approaches, based on semi-analytical formulas, full-wave(More)