Luc Dupas

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• TSV – Conducting nail; typically Cu or W El t i l th f f t id t – Electrical path from front-side to backside of thinned-down silicon wafer – Interconnection of vertically stacked dies • Typical TSV Dimensions − Diameter : 5μm − Height : 50μm Aspect Ratio 1:10 g μ − Min. pitch : 10μm • Benefits over Wire-Bonds h d − High density − Low capacitance deep(More)
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