Lothar Pfitzner

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This paper presents improvements in resizing single crystalline Si wafers by using the dicing technology “Thermal Laser Separation” (TLS). Results of this work support the general need to resize wafers to smaller diameters and will play an important role during the transition to larger wafer diameters as currently projected in the ITRS for 450(More)
Within the ENIAC project “IMPROVE”, new algorithms for virtual metrology and predictive maintenance are being developed to substantially enhance efficiency in European semiconductor manufacturing. The consortium comprises important IC manufacturers in Europe, solution providers, and research institutions. A major objective of the project is to(More)
A yield model was developed allowing the calculation of yield using defect density data of manufacturing equipment. The approach allows studying impact of semiconductor manufacturing equipment on yield, to calculate and monitor yield during semiconductor manufacturing and predicting yield based on real time input of semiconductor manufacturing equipment(More)
In semiconductor manufacturing, the implementation of advanced process control systems has become essential for cost effective manufacturing at high product quality. In addition to established process control methods, new control techniques such as virtual metrology, where post-process quality parameters are predicted from process and wafer state(More)
This paper describes advanced methodologies for defect inspection studies and tool matching at sub 60 nm defect size. The methodologies were affirmed by experimental results achieved on different defect inspection systems designed for non-patterned wafers. The defect inspection has been described successfully by the binomial distribution. The reliability of(More)
Semiconductor manufacturing is a highly complex value-adding process, which is facing an extreme cost pressure. Currently a manufacturing cost reduction of 15 % per year has to be achieved by increased equipment and fab productivity. One contribution for achieving a cost reduction in semiconductor manufacturing is to reduce the effort for defect density(More)
A detailed presentation of history, recent and current projects in the area of Semiconductor Equipment Assessment in Europe were presented. The topics and objectives of the ongoing equipment assessments within the SEA4KET framework were described. The importance on a horizontal and vertical collaboration in a global perspective was elaborated.
The International Technology Roadmap for Semiconductors (ITRS) is probably the single most important document governing the direction of the semiconductor manufacturing industry. The Factory Integration (FI) chapter seeks to define a roadmap for semiconductor factories and enterprise systems. This roadmap has gone through a significant revision over the(More)
Pushing semiconductor manufacturing equipment capabilities to the physical limits is a must to follow Moore's Law in the mid-term future. That is why a novel paradigm of developing new semiconductor manufacturing equipment is needed. Already during the early stages of equipment development, it is inevitable to know as much as possible about the future(More)