Liehui Ren

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A systematic approach for inductance extraction for via arrays between two parallel planes is presented. Both self and mutual inductance values are obtained based on a cavity model. The physics associated with the via inductances is analyzed, and a rigorous method is developed to derive an equivalent total inductance for multiple via arrays. Analytical(More)
A hybrid 3-D and equivalent 2-D finite-element method (FEM) is proposed for signal/power integrity analysis of multiple vias in a shared anti-pad in an arbitrarily shaped parallel-plate pair. The entire domain of the plate pair is decomposed into via-domains and plate domains by virtual interfaces. Complicated fields in via-domains, due to mode conversions(More)
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