We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
3D integrated circuits (3DICs) by stacking electronic devices can increase system functionality while decreasing the overall footprint. Through silicon via (TSV) technology based on thin wafers (typically below 100 μm) has been developed to realize 3DIC stacking over the last decades. Due to their fragileness and tendency of warping, thin device(More)
This paper proposes a basic ARM full system simulation framework, a novel approach to understanding the behavior of modern embedded systems. Our simulation framework implements the kernel architecture of the ARM ISA, on which one can run and debug system or user-level programs. It has flexible software architecture, and good encapsulation of the(More)
Coassemble diverse functional nanomaterials with carbon nanotubes (CNTs) to form three-dimensional (3D) porous CNTs hybrid architectures (CHAs) are potentially desirable for applications in energy storage, flexible conductors, and catalysis, because of diverse functionalities and synergistic effects in the CHAs. Herein, we report a scalable strategy to(More)
Flexible strain-driven sensor is an essential component in the flexible electronics. Especially, high durability and sensitivity to strain are required. Here, we present an efficient and low-cost fabrication strategy to construct a highly sensitive and flexible pressure sensor based on a conductive, elastic aerogel with pyramid design. When pressure is(More)
  • 1