Li Qinghai

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With the development of the integrated circuits, the electronic devices become smaller and smaller, higher density within, and more and more function. The through silicon via (TSV) is the core to the three-dimensional integrated circuit. This paper focuses on the effect to the transmission characteristic of the Ground-Signal-Ground (GSG) TSV. Effects of(More)
In this paper, the short-term scheduling of cascaded hydroelectric chain plants with pumped-storage units is considered. Some integer variables are carefully introduced such that the original problem is successfully formulated as a mixed-integer linear programming. The model given in this paper admits of many complex characteristics such as nonlinear(More)
This paper focuses on the effect to the transmission characteristic of the hollow TSV. Three parts will be figured out to make it around using the high frequency structure simulator: first, the variation of radius and length of the hollow portion; second, the change of the position of hollow portion; the last, the effect to the transmission performance(More)
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