Li-Ming Denq

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There is growing need for embedded memory built-in self-repair (MBISR) due to the introduction of more and more system-on-chip (SoC) and other highly integrated products, for which the chip yield is being dominated by the yield of on-chip memories, and repairing embedded memories by conventional off-chip schemes is expensive. Therefore, we propose an MBISR(More)
3-D integration provides another way to put more devices in a smaller footprint. However, it also introduces new challenges in testing. Flexible test architecture named test access control system for 3-D integrated circuits (TACS-3D) is proposed for 3-D integrated circuits (IC) testing. Integration of heterogeneous design-for-testability methods for logic,(More)
3D ICs based on Through-Silicon-Vias (TSVs) enable the stacking of logic and memory dies to manufacture chips with higher performance, lower power, and smaller form factor. To improve the yield of the memory dies in 3D ICs, this paper proposes a Built-In Self-Repair (BISR) architecture which allows the sharing of spares between different layers of dies. The(More)
One of the major costs in system-on-chip (SOC) development is test cost, especially the cost related to test integration. Although there have been plenty of research works on individual topics about SOC testing, few of them took into account the practical integration issues. In this paper, we stress the practical SOC test integration issues, including real(More)
Memory cores (especially SRAM cores) used on a system chip usually come from a memory compiler. Commercial memory compilers have their limitation— a large memory may need to be implemented with multiple small memories, if generated by memory compilers. In this paper we introduce a testability-driven memory optimizer and wrapper generator that generates(More)
This work presents a low-cost wireless system design that serves as an interface to support the SoC with contactless testability feature. The communication hierarchy includes PHY, MAC, data exchange, and test wrapper functions. The wireless does not require external antennae and crystal reference, and therefore minimize the setup cost. The embedded(More)