Leontios Stampoulidis

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In this paper we present the Efficient Burst Reservation Protocol (EBRP) suitable for bufferless Optical Burst Switching networks. The EBRP protocol is a two-way reservation scheme that employs timed and in-advance reservation of resources. In the EBRP protocol timed reservations are relaxed, introducing a reservation time duration parameter that is(More)
—This paper presents an experimental performance characterization of all-optical subsystems at 40 Gb/s using interconnected hybrid integrated all-optical semiconductor optical amplifier (SOA) Mach–Zehnder interferometer (MZI) gates and flip-flop prototypes. It was shown that optical gates can be treated as generic switching elements and, when efficiently(More)
—We present recent advances in photonic integration introduced by integration-related European research project IST-MUFINS. The contribution of the project in the progress of a functional photonic integration is outlined, from device fabrication to device application focusing on photonic routing using mul-tielement photonic chips. Specifically, we report on(More)
—The objective of this research is to propose two new optical procedures for packet routing and forwarding in the framework of transparent optical networks. The single-wavelength label-recognition and packet-forwarding unit, which represents the central physical constituent of the switching node, is fully described in both cases. The first architecture is a(More)
The introduction of advanced optical modulation formats for coherent data transmission and multilevel signalling enlarges the transmission capacities but also requires more complex opto-electronic components. The need for cost efficient compact solutions is the main driver for photonic-electronic integration technologies. In the framework of the European(More)
BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this(More)
transmission links: (a) multi-wavelength, multi-format transmitter, (b) multi-format regenerator, (c) (i) Silica-on-Silicon motherboard, (ii) SOA, (iii) precision-machined silicon submount fabricated by CIP, (iv) DFB laser and (v) InP modulator developed by HHI. Abstract—Recent advances in the development of photonic switching and transmission systems that(More)