Leonard V. Interrante

  • Citations Per Year
Learn More
We report cross-linked polycarbosilane (CLPCS) films with superior mechanical properties and insensitivity to moisture. CLPCS are prepared by spin-coating and thermal curing of hexylene-bridged disilacyclobutane (DSCB) rings. The resulting films are siloxane-free and hydrophobic, and present good thermal stability and a low dielectric constant of k = 2.5(More)
This article focuses on a relatively new group of organosilicon polymers known as cyclolinear polycarbosilanes (CLPCS). This group of polymers contains 1,3-disilacyclobutane (DSCB) rings, i.e., cyclo-{RSi(CH(2))(2)SiR}-, bridged by various linking groups, so as to form linear chains with regularly spaced, strained, rings that function as latent sites for(More)
The adsorption and decomposition kinetics of the SiC precursor [CH3Si(H)p(CH2)2Si(CH3)CH2SiH 2CH3] I have been studied on the Si(100) surface using a combination of molecular beam mass spectrometry and Auger electron spectroscopy. The intact precursor adsorbes with a heat of adsorption of about 10 kcal/mol. The decomposition rate becomes measurable at about(More)
Work carried in the authors’ laboratory on Si– CH2–Si bridged polycarbosilanes is reviewed. In pursuit of high-yield polymeric precursors to silicon carbide, convenient synthetic routes to both linear and hyperbranched polycarbosilanes having a ‘[SiH2CH2]n’ compositional formula have been developed. The linear [SiH2CH2]n polymer was prepared by ring-opening(More)
Integrating low dielectric permittivity (low-k) polymers to metals is an exacting fundamental challenge because poor bonding between low-polarizability moieties and metals precludes good interfacial adhesion. Conventional adhesion-enhancing methods such as using intermediary layers are unsuitable for engineering polymer/metal interfaces for many(More)
  • 1