Lee Chan Kim

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Wire bond ball grid array technology is widely used in the Intelreg South Bridge, or I/O controller hub (ICH) for a few generations. With the continuing scaling speed of the I/O interfaces, ICH has SATA Gen 2 links and PCI express links operating at 2.5 Gbits/s and 3 Gbits/s respectively within one chip. Due to the heavy traffic and new features, it pushes(More)
As the frequency of the high speed interfaces in computer platforms and systems continue to ramp due to architectural advancement and strong market demands, electronic packages have been stretched to its limit to support these interfaces. The increase in the complexities caused the electrical modeling methodologies to become increasingly complicated and(More)
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