Le Tiang

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Uniformity and planarity are always a challenge and be co me more important in package-level failure analysis with the increase in substrate's complexity. This work highlights novel approach of substrate de-layering by extending laser ablation capability to achieve greatly enhanced de-layering quality and better efficiency relatively to conventional manual(More)
  • 1