Laurent-Luc Chapelon

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3D integration has now made a place in semiconductor landscape and is coming closer from implementation in manufacturing. Although process bricks are almost all available now, there are still several challenges to solve before it is introduced in standard flows. One of those which is not commonly addressed is to get final customer’s interest by showing him(More)
Flip chip is a high-density and highly reliable interconnec-<lb>tion technology which is mandatory for the fabrication of high<lb>end heterogeneous imaging arrays. The control of ultra-fine<lb>pitch (<10 μm) and high bumps count flip-chip bonding tech-<lb>nology represents a challenge on the roadmap of next gene-<lb>ration devices [1].<lb>This paper(More)
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