L. Paivikki Buchwalter

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System-on-Package (SOP) technology based on silicon carriers has the potential to provide modular design flexibility and high-performance integration of heterogeneous chip technologies and to support robust chip manufacturing with high-yield/low-cost chips for a wide range of two-and three-dimensional product applications. Key technology enablers include(More)
System-on-chip (SOC) and system-on-package (SOP) technologies each have advantages depending on application needs. As system architects and designers leverage ever-increasing CMOS technology densities, a range of two and three dimensional silicon integration technologies are emerging which likely support next generation high-volume electronic applications(More)
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