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The objective of this contribution is the optimization of the response of a piezoresistive pressure sensor integrated into a heat spreader for microelectronic applications. Finite element analysis (FEA) calculations are employed to simulate the sensor behavior taking into account mechanical, thermal and electrical effects. The small sensors membrane area(More)
Keywords: Mechanical stress/strain Nanowire Tunnel junction Finite element method Pressure sensor Ultra-thin membrane NEMS a b s t r a c t Mechanical stress is increasingly applied in microelectronics. For instance, strained silicon technology is widely used to improve carrier mobility and then driver current for advanced MOS transistors. For(More)
In this article, we study the relation between knowledge transfers from the outside to the firm and performance. We propose a relation in the form of an inverted U, due to the relation between the value and the cost of the knowledge acquired. We also incorporate the idea that the transferability of knowledge and the degree to which knowledge is transferred(More)
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