L. Mercado

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In MEMS packages and silicon devices, the adhesion of interconnects to the substrate is a critical reliability issue. A Precracked Line Scratch Test (PLST) is among one of the available tests to measure the thin line adhesion. In the test, an initial crack is introduced at the interface between the thin line and the substrate. The line is then loaded from(More)
It is essential to understand solder joint strains to improve package reliability. However, it is often difficult to measure the true solder joint strains directly. Strain gages have been increasingly used to indicate package mechanical stress levels. One of the most used strain gage locations is on the component side, right next to the package corner. A(More)
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