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Enhanced thermal conductivity of epoxy-graphene composites by using non-oxidized graphene flakes with non-covalent functionalization.
Homogeneous distribution of graphene flakes in a polymer matrix, still preserving intrinsic material properties, is key to successful composite applications. A novel approach is presented to disperseExpand
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Enhanced electrical conductivity of nanocomposites containing hybrid fillers of carbon nanotubes and carbon black.
Nanocomposites reinforced with hybrid fillers of carbon nanotubes (CNTs) and carbon black (CB) are developed, aiming at enhancing the electrical conductivity of composites with balanced mechanicalExpand
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Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure
Electromigration damage in the flip chip solder bump of 97Pb–3Sn/37Pb–63Sn (numbers are all in wt% unless specified otherwise) combination structure was studied after current stressing at 140C with aExpand
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Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications
In this paper, a chip-in-flex (CIF) assembly that has an excellent bending performance, including a minimum bending radius without a chip fracture and the capacity to withstand dynamic bending, isExpand
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A novel double layer NCF for highly reliable micro-bump interconnection
40 μm pitch Cu-pillar/Sn-Ag bump to Ni pad thermo-compression bonding was performed using non-conductive films (NCFs) with different curing agents. The joint morphology of Cu-pillar/Sn-Ag bump/Ni padExpand
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Frequency and Temperature Dependence of Dielectric Constant of Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate
In this study, temperature dependence of capacitance, one of the most important properties of ECFs, was investigated. Temperature dependence of ECFs capacitance was determined by temperatureExpand
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Wafer Level ACA Packages and their Applications to Advanced Electronic Packaging
Recently, wafer level package (WLP) has become one of the promising packaging technologies due to its advantages such as fewer processing steps, lower cost, and enhanced device performance comparedExpand
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A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding
In this paper, the electrical and reliability properties of various solder anisotropic conductive film (ACF) joints for flex-on-board (FOB) assembly using ultrasonic bonding were assessed in terms ofExpand
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A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling
A study of the failure mechanism and the enhanced reliability performance of SnBi58 solder ACF joints were investigated by considering the total influence of polymer viscoelastic and hygroscopicExpand
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Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
Nowadays, major trends in the design of electronic products are toward multifunction and miniaturization. To meet these trends, system-in-package (SiP) has been adapted as one of the core packagingExpand
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