Kwang-Seong Choi

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We propose and demonstrate the use of subcarrier/polarization-interleaved training symbols for channel estimation and synchronization in polarization-division multiplexed (PDM) coherent optical orthogonal frequency-division multiplexed (CO-OFDM) transmission. The principle, the computational efficiency, and the frequency-offset tolerance of the proposed(More)
We present high-sensitivity photoreceivers based on a vertical- illumination-type 100% Ge-on-Si p-i-n photodetectors (PDs), which operate up to 50 Gb/s with high responsivity. A butterfly-packaged photoreceiver using a Ge PD with 3-dB bandwidth (f(-3dB)) of 29 GHz demonstrates the sensitivities of -10.15 dBm for 40 Gb/s data rate and -9.47 dBm for 43 Gb/s(More)
Through silicon via (TSV) based 3D-IC is the key technology to satisfy the continuously growing demand on lower power consumption, higher system bandwidth and smaller form factor of electronic devices. As the I/O count increases up to the order of tens of thousands for high speed data transmission, TSV diameter and interconnection pitch are reduced, which(More)
Using an electro-absorption duplexer (EAD) we presented a transceiver (TRx) module for dual function of both electrical-to-optical (E/O) and optical-to-electrical (E/O) conversion at 60 GHz band. The EAD chip was fabricated by monolithically integrating both a waveguide photodiode (PD) and an electro-absorption modulator (EAM) in association with traveling(More)
Development of through silicon via (TSV) based 3 dimensional integrated circuit (3D-IC) has allowed reduction of form factor and power consumption with higher data transmission speed. Despite the great advantages, various types of defects cannot be avoided in continuously reducing scale of the components. The performance degradation caused by defects has to(More)
Vertical interconnections of stacked chips through the silicon substrates have enabled higher performance of electronic products with lower power consumption. The advantage of through silicon via (TSV) technique can be maximized by increasing the number of I/Os, which requires fine pitch and smaller diameter. The scale-down of TSVs results in decreased(More)
We developed a transmitter module with an electro-absorption modulator (EAM) for a 60 GHz band radio-over-fiber (RoF) link. It consists of an EAM device, a microstrip filter, and a low noise amplifier (LNA). The microstrip filter was used to achieve the impedance matching between the EAM device and the LNA and to reject the local oscillator (LO) frequency(More)
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