Kurt Ronse

  • Citations Per Year
Learn More
There are still three major technological lithography options for high volume manufacturing at the 32 nm half pitch node: 193 nm immersion lithography with high index materials, enabling NA > 1.6; 193 nm double patterning and EUV lithography. In this paper the pros and cons of these three options are discussed. The extendibility of these options beyond(More)
  • 1