Kuo-Ning Chiang

Learn More
The flip chip packaging structure design and the fabrication process parameters will influence the packaging reliability and the performance of chip heat dissipation. The reliability of a flip chip package depends on the packaging structure design parameters, which include solder bump geometry, die side pad and substrate side pad dimensions, etc. In order(More)
By applying the etching via technology, this study proposes a novel front-side etching fabrication process for a silicon-based piezoresistive pressure sensor to replace the conventional backside bulk micro-machining. This novel structure pressure sensor can achieve the distinguishing features of the chip size reduction and fabrication costs degradation. In(More)
Probe-after-bump is the primary probing procedure for flip chip technology, since it does not directly contact the bump pad, and involves a preferred under bump metallurgy (UBM) step coverage on the bump pads. However, the probe-after-bump procedure suffers from low throughputs and high cost. It also delays the yield feedback to the fab, and makes difficult(More)