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Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images
Electrical circuits of Printed Wiring Boards (PWBs) have become multi-layered. Therefore, the formation of micro-blind holes for interlayer electrical connections (blind via holes: BVH) is required.… Expand
Microvia Formation for Multi-Layer PWB by Laser Direct Drilling: Improvement of Hole Quality by Silica Fillers in Build-Up Layer
Microvia formation technology using lasers has become the dominant method for drilling microvia called blind via-holes (BVHs) in printed wiring boards (PWBs). Laser direct drilling (LDD), drilling… Expand