Kunal Kashyap

Learn More
The unavoidable occurrence of microdefects in silicon wafers increase the probability of catastrophic fracture of silicon-based devices, thus highlighting the need for a strengthening mechanism to minimize fractures resulting from defects. In this study, a novel mechanism for manufacturing silicon wafers was engineered based on nanoscale reinforcement(More)
Defects and heterogeneities degrade the strength of glass with different surface and subsurface properties. This study uses surface nanostructures to improve the bending strength of glass and investigates the effect of defects on three glass types. Borosilicate and aluminosilicate glasses with a higher defect density than fused silica exhibited 118 and 48 %(More)
In this study, we mechanically strengthened a borosilicate glass wafer by doubling its bending strength and simultaneously enhancing its transparency using surface nanostructures for different applications including sensors, displays and panels. A fabrication method that combines dry and wet etching is used for surface nanostructure fabrication.(More)
  • 1