Kun-Fu Tseng

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— Because of the coefficient of thermal expansion and the hygroscopic swelling mismatches on plastic packaging materials , stress and reliability issues on microelectronic packaging structures are extremely important for the packaging industry. Through the self-design test chips with the piezoresistive microstress sensors, this paper presents the(More)
This study proposes a post-processor to reduce the effect of musical residual noise which is annoying to the human ear. Initially, a state-of-the-art speech enhancement algorithm is performed as the first stage to reduce background noise for noisy speech. Hence the enhanced speech is post-processed by a hybrid-mean filter to reduce the musical effect of(More)
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