Kuang-Yao Lee

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Reducing the yield loss due to via failure is one of the important problems in design for manufacturability. A well known and highly recommended method to improve via yield/reliability is to add redundant vias. In this paper we study the problem of post-routing redundant via insertion and formulate it as a maximum independent set (MIS) problem. We present(More)
We modeled nutrient export in the Choptank River Basin on the coastal plain of the Chesapeake drainage, using a modified version of a lumped-parameter, hydrochemical model (GWLF). Calibration was performed using long-term (WY1980–WY1990) hydrochemistry data from a gauged site. The calibrated model reproduced water yields, TN, and TP export with cumulative(More)
Redundant via insertion is highly effective in improving chip yield and reliability. In this paper, we study the problem of <i>double-cut</i> <i>via</i> <i>insertion</i> (DVI) in a post-routing stage, where a single via can have, at most, one redundant via inserted next to it and the goal is to insert as many redundant vias as possible. The DVI problem can(More)
Redundant via insertion and line end extension employed in the post-routing stage are two well known and highly recommended techniques to reduce yield loss due to via failure. However, if the amount of inserted redundant vias is not well controlled, it could violate via density rules and adversely worsen the yield and reliability of the design. In this(More)
Redundant via insertion is highly recommended for improving chip yield and reliability. In this paper, we study the problem of <i>double-cut via insertion</i> (DVI) in a post-routing stage, where a single via can have at most one redundant via inserted next to it and the goal is to insert as many redundant vias as possible. The DVI problem can be naturally(More)
Based on clustered data with informative cluster size, two efficient estimation methods are proposed for marginal models. In our procedures, the information of within-cluster correlation and minimum cluster size is fully used; this is not the case with the within-cluster re-sampling (WCR) and cluster-weighted generalized estimating equation (CWGEE) methods.(More)
The multiclass classification problem is considered and resolved through coding and regression. There are various coding schemes for transforming class labels into response scores. An equivalence notion of coding schemes is developed, and the regression approach is adopted for extracting a low-dimensional discriminant feature subspace. This feature subspace(More)
As IC process geometries scale down to the nanometer territory, the industry faces severe challenges of manufacturing limitations. To guarantee yield and reliability, physical design for manufacturability and reliability has played a pivotal role in resolution and thus yield enhancement for the imperfect manufacturing process. In this paper, we introduce(More)
In this paper, we formulate a problem of simultaneous redundant via insertion and line end extension for via yield optimization. Our problem is more general than previous works in the sense that more than one type of line end extension is considered and the objective function to be optimized directly accounts for via yield. We present a zero-one integer(More)