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Conventional gel electrodes are widely used for biopotential measurements, despite important drawbacks such as skin irritation, long set-up time and uncomfortable removal. Recently introduced dry electrodes with rigid metal pins overcome most of these problems; however, their rigidity causes discomfort and pain. This paper presents dry electrodes offering(More)
This paper reports the impact of ageing on the cohesive and adhesive strength of overmould materials used in electronic packages. For so-called harsh environment applications, the overmoulded package operates in an ambient at a continuous temperature of 175°C, or sometimes even 200°C. At these high temperatures, it can be expected that the(More)
Nanoindentation technique is commonly used to characterize the mechanical properties of thin films. However, the validity of the measurements is greatly affected by the indentation depth and the substrate properties. The purpose of this study is to understand the influence of the substrate properties, the thin film thickness and the mechanical properties of(More)
This work presents two different methods that offer a faster, easier and more straightforward data analysis methods for Young's modulus extraction of plastic molding compound materials. Both methods are compared and verified with the nano-indentation (NI) technique. The originality of this study lies in the fact that the evaluation of these methods focuses(More)
At nanoscale level, the strength of the BEOL is determined by two competing failure mechanisms: adhesive failure (delamination) at the different interfaces and cohesive failure within the Cu-vias or in the low-k material. Different approaches to model delamination by FEM are discussed an evaluated. Although the current techniques are useful for qualitative(More)
Atomic layer deposition of ruthenium is studied as a barrierless metallization solution for future sub-10 nm interconnect technology nodes. We demonstrate the void-free filling in sub-10 nm wide single damascene lines using an ALD process in combination with 2.5 Å of ALD TiN interface and postdeposition annealing. At such small dimensions, the ruthenium(More)