Kris Vanstreels

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0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.06.003 ⇑ Corresponding author at: imec, Kapeldreef 75, B +32 16 281 463. E-mail address: (I. De Wolf When Cu ‘Through-Silicon-Vias’ (TSVs) are exposed to high temperatures as typically encountered during the back-end of line (BEOL) processing, the higher(More)
Conventional gel electrodes are widely used for biopotential measurements, despite important drawbacks such as skin irritation, long set-up time and uncomfortable removal. Recently introduced dry electrodes with rigid metal pins overcome most of these problems; however, their rigidity causes discomfort and pain. This paper presents dry electrodes offering(More)
Within this paper, the authors propose a refined high vacuum scanning spreading resistance microscopy HV-SSRM electromechanical nanocontact model based on experimental results as well as molecular dynamics MD simulation results. The formation under the tip of a nanometer-sized pocket of -tin, a metastable metalliclike phase of silicon also named Si-II ,(More)
This work presents two different methods that offer a faster, easier and more straightforward data analysis methods for Young's modulus extraction of plastic molding compound materials. Both methods are compared and verified with the nano-indentation (NI) technique. The originality of this study lies in the fact that the evaluation of these methods focuses(More)
Nanoindentation technique is commonly used to characterize the mechanical properties of thin films. However, the validity of the measurements is greatly affected by the indentation depth and the substrate properties. The purpose of this study is to understand the influence of the substrate properties, the thin film thickness and the mechanical properties of(More)
At nanoscale level, the strength of the BEOL is determined by two competing failure mechanisms: adhesive failure (delamination) at the different interfaces and cohesive failure within the Cu-vias or in the low-k material. Different approaches to model delamination by FEM are discussed an evaluated. Although the current techniques are useful for qualitative(More)
: Because of its optical and electrical properties, large surfaces, and compatibility with standard silicon processes, porous silicon is a very interesting material in photovoltaic and microelectromechanical systems technology. In some applications, porous silicon is annealed at high temperature and, consequently, the cylindrical pores that are generated by(More)